Abstract:

Three-dimensional (3D) integrated circuit integration including TSV has become the mainstream in semiconductor technology with the advantages of small-form factor, high-performance, low power consumption, and high density integration. Wafer-level packaging is one of the fastest growing segments in semiconductor packaging industry due to the rapid advances in integrated circuit (IC) fabrication and the demands of a growing market. At the same time, substrate-less, or flexible, foldable and stretchable substrates have emerged for the advanced packaging design and new applications, such as, in paperlike displays, skin sensors, health monitoring devices and portable and wearable electronic devices. In this presentation, the state-of-the-art development and advances in IC packaging will be presented.

Biography:

Dr. Fan is currently a Professor in the Department of Mechanical Engineering at Lamar University, Beaumont, Texas. He was a Senior Staff Engineer at Intel Cooperation, Chandler, Arizona, from 2004 to 2007, a Senior Member Research Staff with Philips Research Lab at Briarcliff Manor, New York from 2001 to 2004, and a Member Technical Staff and Group Leader at the Institute of Microelectronics (IME), Singapore from 1997 to 2000. Dr. Fan's interests and expertise lie in the areas of reliability, design, modeling, and material characterization in micro-/nano- electronic packaging and microsystems. He is an Associate Editor of IEEE Transactions on Components and Packaging Technologies. Dr. Fan has given many keynote presentations and tutorials in worldwide institutions, companies and conferences. Dr. Fan received IEEE CPMT Exceptional Technical Achievement Award in 2011. He won the Best Paper Award of 2008 IEEE Transactions on Components and Packaging Technologies in 2009. He was elected as IEEE Distinguished Lecturer in 2008. He serves as chairs, co-chairs, advisory and technical committee members of ECTC, EPTC, ESTC, EuroSimE, ICEPT, ESREF, EMPT, and ChinaSSL. Dr. Fan has published more than 180 scientific papers, 25 book chapters, 3 books, and filed several patents in worldwide patent offices.

Dr. Fan received his Ph.D. degree in solid mechanics from Tsinghua University, Beijing, China in 1989. He earned his Master degree and Bachelor degree in applied mechanics from Tianjin University, Tianjin, China in 1986 and 1984. In his earlier career he held a faculty position at Taiyuan University of Technology, Shanxi, China from 1989 to 1997. He received the Young Scientist Fellowship from Japan Society of Promotion of Science (JSPS) to work at the University of Tokyo, Tokyo, Japan from 1993 to 1994. He was a visiting professor at the University of British Columbia, Vancouver, Canada from 1996 to 1997. Dr. Fan was promoted to a full professor at Taiyuan University of Technology, Taiyuan, Shanxi in 1991, and became one of the youngest professors in China when he was at the age of 27. He was a nominee for the title of "1991 Ten Outstanding Youth of China", and received Young Faculty Award in 1994 from Fok Ying-Tung Education Foundation.